Engineering services:
– DFM, DFT, DOE
– Develop control plans & PFMEA
– Value add engineering services
Assembly services:
– NPI
– SMT: Surface mount assembly, single & double-sided
– Plated through-hole: Selective soldering
– Mixed technologies: SMT, through-hole, electro-mechanical assembly
General assembly capabilities:
– BGA, micro-BGA, QFN, CSP and any leadless devices up to .35mm pitch assembly with 100% 3D X-ray inspection
– PCB components, including all types of BGAs, QFNs, CSPs, 0201, 01005, 08004, POP, and press fit components in small quantities
– DFA process identifies almost all manufacturing issues before actual assembly saving production holdups
– RoHS, leaded, indium, clean & no clean chemistries
– Paste in-hole
– De-ionized water cleaning of assembled boards
PCBA test:
– Flying probe test including boundary scan
– Functional test: Board & system level test including engineering support for developing test platforms
Other value add services:
With our key partners, Sierra’s expertise extends to the following:
– Reliability test includes temperature cycling
– Wire bonding
– Conformal coat
– ICT: Develop test fixtures and testing with our key partners